252-day price high (breakout)
ActiveAdjusted close makes a new 252-day high; repeats within 20 days counted once.
120 days after: historical avg +17.25%
Over 20 occurrences, 120-day forward avg gained 17.25%, beat the market by 7 pts; win rate 70%.
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quality needs a look, premium valuation.
Weak profitability.Operating margin is in the 30th market percentile. Latest quarterly ROE ≈ 0.1%.
Valuation is high.PE is in the 100th market percentile; within its own history, PE is around the 100th percentile.
Foreign investors are net buying.Foreign 20-day net flow ≈ 4.3% of volume (net buy).
Signals are active now.On the latest data, signals such as 252-day price high are active — see the historical forward returns after each occurrence below.
Single-sided accumulation, concentration rising — bullish
Window from 2026-01-17 · Price +193% · branches to 2026-06-17· TDCC to 2026-06-12
Direction matches: big-holder share rose while retail share fell.
Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.
These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.
Adjusted close makes a new 252-day high; repeats within 20 days counted once.
120 days after: historical avg +17.25%
Over 20 occurrences, 120-day forward avg gained 17.25%, beat the market by 7 pts; win rate 70%.
Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.
| PE percentile band | Sample days | 240-day avg return | Median | Win rate | Avg excess (vs index) |
|---|---|---|---|---|---|
| 0-20 | 124 | +12.4% | +9.5% | 82.3% | -13.1% |
| 20-40 | 321 | +4.5% | -0.6% | 48.3% | -24.8% |
| 40-60 | 172 | -12.8% | -24.7% | 16.3% | -42.3% |
| 60-80 | 251 | +10.2% | -26.5% | 41.8% | -12.9% |
| 80-100 You are here | 447 | +22.5% | +0.9% | 51% | +7.1% |
Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.
Current PE ≈ 2850.0, at the 100.0th percentile of its own history (80-100 band).
Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.
Currently in “Expensive (own-history top 1/3) × 60-day momentum up”: across 347 historical days, 120-day forward avg gained 15.4%, win rate 74.4%, beat the market by 8%.
Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.
These are not occurring now; historical samples shown for comparison.
Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).
99 times historically; 60-day forward avg +2.53%, win rate 42.9%, beating the market by +1.15 pts on average.
Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.
57 times historically; 60-day forward avg +6.5%, win rate 49.1%, beating the market by +0.51 pts on average.
合晶科技成立於1997年7月,股票代號6182,2002年5月於櫃買中心上櫃,為營運公司普通股。總部與龍潭廠位於桃園市龍潭科學園區龍園一路100號,另有楊梅廠、二林廠籌備/新廠,以及中國大陸上海、鄭州、揚州等轉投資生產據點。董事長為焦平海,總經理兼發言人為張憲元。公司官網公司概況揭露資本額為新台幣5,737,967,300元、普通股573,796,730股(最後更新日2025-12-23);Yahoo/公開資訊系統資料時間2026-01-20則列股本5,736,383,300元、普通股573,638,330股,差異應與限制員工權利新股註銷/股本變動時點有關。2025年報列截至2026-04-30從業員工合計2,411人,其中管理792人、研發技術515人、作業1,104人,平均年歲39.1歲、平均服務年資5.6年。2025年報列2026-04-20前十大股東包括焦平海12,646,405股、持股2.20%;花旗受託保管波露寧新興市場基金投資專戶6,441,923股、1.12%;華榮電線電纜5,951,040股、1.04%;其餘多為外資保管專戶及英屬維京群島商吉興國際等,單一股東持股比例皆低於3%。公司沿革稱創始團隊來自美國矽谷及台灣半導體產業,目前為全球前十大半導體矽晶圓材料供應商之一;2024年子公司上海合晶硅材料於上海證交所科創板IPO。
合晶主要從事半導體矽晶材料、半導體磊晶材料及化合物半導體材料之研發、設計、製造與銷售,並提供相關產品技術諮詢、服務與進出口貿易。2025年報揭露114年度營收結構為半導體產品新台幣9,757,317仟元、占99.39%,其他59,925仟元、占0.61%,合計9,817,242仟元。主要產品包含半導體矽晶棒、半導體矽晶圓(單面拋光片與雙面拋光片)、半導體磊晶片、SOI晶片與GaN磊晶片。官網產品頁說明產品涵蓋12吋含以下各種摻質的拋光晶圓、磊晶晶圓、雙拋晶圓、研磨晶圓、蝕刻晶圓、超薄晶圓及SOI晶圓,並以長晶至磊晶的整合技術提供客製化材料。終端應用包括MEMS、功率MOSFET、PMIC、BJT、二極體、閘流體、IGBT、CoolMOS、Superjunction、CIS影像感測器、LED driver、標準邏輯IC、ASIC與RF元件。商業模式為自有品牌Wafer Works之矽晶圓材料供應商,銷售給晶圓代工廠、IDM、功率元件與類比IC供應鏈;年報主要客戶採匿名揭露,113年度客戶A占銷貨16.57%,114年度客戶A占16.31%,115年第一季客戶B占12.18%,其餘客戶分散。主要原料為矽多晶料、研磨粉與拋光漿、坩堝,年報僅揭露供應商為國際知名大廠且供應狀況良好,未具名。
2025至2028年展望重點在12吋矽晶圓、先進封裝材料、AI/HPC、功率半導體、SOI與GaN。2025年報指出全球矽晶圓2025年出貨量為12,973百萬平方英吋、年增5.8%,預期2026年起半導體矽晶圓出貨面積可望持續成長;12吋晶圓受惠先進邏輯與HBM需求,成為主要成長動能。合晶短期計畫為積極擴充12吋產能,龍潭廠12吋產能目標於2026年4月達40K/M;二林廠與鄭州廠於2026年陸續展開12吋矽晶圓送樣,並配合客戶需求啟動新產品專案;二林廠先進拋光片隨驗證推進啟動量產。長期計畫為走向AI與次世代半導體材料,包含8吋GaN磊晶片切入AI伺服器電源管理、大尺寸方型晶圓與SiC載板切入AI晶片先進封裝與散熱瓶頸、SOI技術切入矽光子/次世代光通訊。官網2026-05-08新聞稱二林新廠已於2026-04-30產出首根12吋矽晶圓晶棒,標誌二林廠進入營運生產階段;2026-06-15媒體報導合晶310mm x 310mm方型矽晶圓已進入客戶驗證,鎖定AI、HPC與先進封裝需求。主要風險包括半導體循環與客戶需求快速變動、交期縮短、地緣政治與區域貿易衝突、少量多樣造成生產效率限制、產品組合/利率/製造成本壓抑毛利率、中國大陸新競爭者加入、12吋新產能稼動與客戶驗證進度不確定、資本支出與折舊壓力。
This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.
This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.