252-day price high (breakout)
ActiveAdjusted close makes a new 252-day high; repeats within 20 days counted once.
Over 5 occurrences, 20-day forward avg gained 9.18%, beat the market by 4.5 pts; win rate 60%.
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steady quality, premium valuation.
Above-average profitability.Operating margin is in the 64th market percentile. Latest quarterly ROE ≈ 4.8%.
Valuation is high.PE is in the 93th market percentile.
Foreign investors are net buying.Foreign 20-day net flow ≈ 2.9% of volume (net buy).
Strong revenue growth.Latest monthly revenue YoY ≈ 115.2%, above the 20% growth threshold.
Signals are active now.On the latest data, signals such as 252-day price high, Revenue YoY ≥ 20% are active — see the historical forward returns after each occurrence below.
Distribution to retail — bearish
Window from 2026-01-17 · Price +120% · branches to 2026-06-17· TDCC to 2026-06-12
Weak direction: big-holder share fell while retail share rose.
Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.
These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.
Adjusted close makes a new 252-day high; repeats within 20 days counted once.
Over 5 occurrences, 20-day forward avg gained 9.18%, beat the market by 4.5 pts; win rate 60%.
Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).
120 days after: historical avg +12.75%
Over 21 occurrences, 120-day forward avg gained 12.75%, lagged the market by 0.58 pts; win rate 38.1%.
Over the past 242 months, on average ~404 stocks per month met “monthly revenue YoY ≥ 20%”; their adjusted-close return over the next 60 trading days averaged 6.94% (equal-weighted), beating the market by 2.37 points on average, and outperformed the TAIEX total-return index in 64.5% of months.
Each month, equal-weighted 60-day forward adjusted return of all signal-matching stocks, then averaged across months; excess vs the TAIEX total-return index.
These are not occurring now; historical samples shown for comparison.
Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.
15 times historically; 60-day forward avg +4.73%, win rate 42.9%, beating the market by -3.27 pts on average.
廣閎科技股份有限公司成立於2007年11月1日,統一編號28870892,總部位於新竹縣竹北市台元二街8號8樓之3,電話03-5525766。公司於2022年3月1日正式上櫃交易,櫃買中心代號6693,普通股每股面額新台幣10元;依櫃買公開基本資料,截至2026年6月16日資料,實收資本額為新台幣457,200,000元,已發行普通股45,720,000股,無特別股、無私募股。董事長兼總經理為林明璋,發言人為管理處處長潘嘉君。2025年年報揭露2025年度員工人數92人,未兼任員工之董事6人。公司英文簡稱為inergy,官方說明inergy結合innovation與energy,定位為專注於節能應用之IC設計公司。主要股東依公司官網最近期停止過戶日2025年4月8日股東名冊:茂迪股份有限公司持股8,558,750股、18.72%;元大商業銀行受託保管盧森堡商達爾國際股份有限公司投資專戶3,380,000股、7.39%;蕭地域1,769,520股、3.87%;林明璋1,294,540股、2.83%;富邦金控創業投資股份有限公司1,209,000股、2.64%;廖崇維1,120,220股、2.45%;曾國慶842,000股、1.84%;倪崇堯741,034股、1.62%;吳宗霖738,000股、1.61%;饒志華562,000股、1.23%。
廣閎科為無晶圓廠IC設計公司,主要核心產品為Power MOSFET功率元件、BLDC Motor Driver無刷直流馬達驅動控制模組,以及數位類比可程式化SoC散熱風扇驅動IC。商業模式是自行研發設計功率半導體元件、馬達驅動控制與韌體/系統方案,委由晶圓代工廠與封裝測試廠生產,再銷售給終端電子、家電、電機、散熱、伺服器、儲能、工控、通訊與車用相關客戶。2025年度營業收入淨額為新台幣1,413,767千元;個體營業收入明細表顯示產品銷售約新台幣1,402,702千元,其中功率半導體元件新台幣959,606千元,約占產品銷售68.4%;無刷直流馬達驅動控制模組新台幣305,979千元,約占21.8%;數位類比可程式化SoC散熱風扇驅動IC新台幣143,509千元,約占10.2%;其他與退回折讓後合計為淨額。銷售地區方面,2025年內銷新台幣496,881千元、35.15%;外銷新台幣916,886千元、64.85%,其中中國新台幣906,331千元、64.11%,越南新台幣10,382千元、0.73%,其他0.01%。主要終端應用包括消費性電子、白色家電、小家電、PC/NB、雲端資料中心與伺服器電源系統、伺服器散熱、基地台散熱、工控、通信、儲能系統、電動載具與車用應用。公司2026年3月20日法說會揭露,伺服器相關出貨占比由2024年約2%、2025年約13%,提高至2026年第1季預估約25%;消費性電子占比由2024年約42%、2025年約36%,至2026年第1季預估約32%。公司年報提及其BLDC方案已取得日本馬達電機大廠、中國大陸家電品牌大廠認證及量產,SoC散熱風扇驅動IC曾獲CPU大廠散熱系統認證與量產,但未揭露具名客戶。
2025至2028年展望重點在AI伺服器電源與散熱、低碳節能功率元件、BLDC高效電機控制、儲能與車用應用。2025年公司營收新台幣1,413,767千元,較2024年1,094,185千元成長;年報指出自2024年第3季起受惠AI伺服器散熱產品及儲能相關需求,AI伺服器電源與散熱解決方案銷售貢獻持續增加。產品動能包括:超高電流大於300A、超低阻抗特殊Power MOSFET已在AI伺服器電源系統量產;中壓電源與電池管理MOSFET已導入車用市場;2025年度開發成功項目包含超低阻抗高電流功率元件導入AI伺服器電源系統、中壓電源與電池管理MOSFET導入車用市場、推出碳化矽SiC產品。2026年公司進程規劃聚焦伺服器/資料中心,包含伺服器電源高功率Power MOSFET、SiC產品系列、伺服器周邊SoC散熱風扇驅動IC、伺服器12V氣冷散熱與Sidecar 48V氣冷散熱BLDC Motor Driver。中長期產品策略包含持續開發下世代高電流低導通阻抗功率半導體、高轉速高效能伺服電機驅動系統、高整合度高電流SoC馬達驅動IC、驅動IC整合Power MOSFET模組、高電壓碳化矽元件,以及導入智能算法與自適應控制。產業趨勢方面,AI運算、雲端資料中心、伺服器電源架構升級、液冷/氣冷散熱、儲能系統、車用電池、充電樁、工控與通訊基地台均有助於提高高效能功率元件與BLDC驅動需求。供給面,公司年報表示會與晶圓代工廠簽訂供貨保證合約、提高設備資本投資,並與晶圓廠、封測廠及電路板組裝廠維持長期合作。主要風險包括:功率半導體國際IDM大廠競爭激烈;產品客製化與design-in週期長,若認證不如預期會影響成長時點;外銷高度集中中國市場,面臨地緣政治、匯率與需求波動;供應商與加工廠因碳稅、碳交易或能源成本上升轉嫁成本;晶圓代工、封測產能與供應鏈中斷風險;美國德州東區聯邦法院終端客戶使用MOSFET產品之專利侵權訴訟費用/損失分攤風險;2027至2028具體財務預測未由公司公開揭露,僅能依產品線與產業趨勢推估。
This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.
This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.