252-day price high (breakout)
ActiveAdjusted close makes a new 252-day high; repeats within 20 days counted once.
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steady quality, premium valuation.
Above-average profitability.Operating margin is in the 58th market percentile. Latest quarterly ROE ≈ 2.7%.
Valuation is high.PE is in the 93th market percentile.
Foreign investors are net selling.Foreign 20-day net flow ≈ -2.1% of volume (net sell).
Strong revenue growth.Latest monthly revenue YoY ≈ 58.7%, above the 20% growth threshold.
Signals are active now.On the latest data, signals such as 252-day price high, Revenue YoY ≥ 20% are active — see the historical forward returns after each occurrence below.
Single-sided accumulation, concentration rising — bullish
Window from 2026-01-17 · Price +162% · branches to 2026-06-17· TDCC to 2026-06-12
Direction matches: big-holder share rose while retail share fell.
Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.
These signals are true on the latest data, with this stock's own historical forward-return stats after each occurrence.
Adjusted close makes a new 252-day high; repeats within 20 days counted once.
Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).
120 days after: historical avg -2.87%
Over 15 occurrences, 120-day forward avg declined 2.87%, lagged the market by 12.51 pts; win rate 33.3%.
Over the past 242 months, on average ~404 stocks per month met “monthly revenue YoY ≥ 20%”; their adjusted-close return over the next 60 trading days averaged 6.94% (equal-weighted), beating the market by 2.37 points on average, and outperformed the TAIEX total-return index in 64.5% of months.
Each month, equal-weighted 60-day forward adjusted return of all signal-matching stocks, then averaged across months; excess vs the TAIEX total-return index.
These are not occurring now; historical samples shown for comparison.
Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.
11 times historically; 60-day forward avg +8.27%, win rate 77.8%, beating the market by -0.88 pts on average.
天二科技股份有限公司為普通股上市公司,股票代號6834,主要經營專業晶片電阻之製造與銷售。公開資訊顯示法定設立日期為1970/02/16;公司官網與2025年法說會則以1988年作為公司概況成立年份,推測係現行晶片電阻業務或品牌發展起點。總部與高雄工廠位於高雄市前鎮區南四路3號,電話07-8116611。董事長/執行長為廖震益,總經理與發言人為黃弘傑。公司於2021/08/25登錄興櫃,2022/09/01轉上市,市場別為上市。實收資本額884,710,820元,已發行普通股88,471,082股,無特別股與公司債。2025年法說會揭露營運據點包含高雄工廠、台北辦公室、深圳分公司及麗智南通工廠;高雄工廠面積19,498平方公尺、員工380人,麗智南通工廠面積100,000平方公尺、員工700人,台北辦公室20人、深圳分公司30人。114年度年報揭露天二本體最近年度從業員工合計435人,115年截至2月底431人。主要股東依114年度年報、115/03/28資料:玉古投資7,567,000股、8.55%;AKANE (H.K.) ELECTRONICS LIMITED 6,435,000股、7.27%;佰記投資4,075,000股、4.61%;琪瓏投資4,046,000股、4.57%;金茂投資2,925,000股、3.31%;致和證券2,843,769股、3.21%;廖震益2,630,000股、2.97%;駿毅管理顧問2,491,000股、2.82%;吳志遠2,000,000股、2.26%;麒威投資1,880,000股、2.12%。114年度股利政策經董事會決議每股配發現金股利0.2元及資本公積0.2元,合計0.4元,並經115年股東常會通過。
公司定位為專業晶片電阻製造商,主要產品為厚膜電阻、薄膜電阻及金屬板電阻,研發、製造與銷售並重。114年度營收1,430,883千元,年增12.86%;營業毛利256,196千元,毛利率17.90%;營業淨利44,674千元,稅後淨利44,398千元,EPS 0.50元。114年度產品營收結構:厚膜電阻558,572千元、39.03%;薄膜電阻371,540千元、25.97%;金屬板電阻494,307千元、34.55%;其他6,464千元、0.45%。厚膜產品包含高功率、抗硫化、車用、耐突波、高壓/超高壓、寬電極與Array厚膜電阻;薄膜產品包含升功率薄膜、極精密薄膜、低阻金屬膜、抗硫化與抗突波低阻金屬膜;金屬板產品包含陶瓷貼膜微歐姆、金屬板微歐姆與檢流器金屬板微歐姆電阻。商業模式包含自有品牌、經銷代理、直接服務客戶及同業合作,透過規格設計導入、樣品認證、量產供貨與客製化解決方案形成客戶黏著度。下游應用依2025年法說會2025Q3資料:電源裝置35%、車用電子18%、AI 6%、消費電子10%、工業電子6%、其他25%;2024年地區銷售比重約台灣20%、中國大陸74%、其他6%。114年度前兩大客戶於年報中匿名為S1與S2,S1銷售292,895千元、20.47%,S2銷售132,582千元、9.27%,客戶名稱未公開;公司描述主要客戶為經銷代理商與國內外知名大廠。原料以基板、膏品、包材為主,主要原料另包括陶瓷基板、油墨、鈀材及合金原材。
2025年公司已完成庫存去化後的產能利用率與製造效率改善,全年營收1,430,883千元,年增12.86%;2026年1至5月累計營收789,119千元,年增30.2%,顯示短期接單與出貨動能較2025年同期改善。公司2026年營運目標為年營收雙位數成長,主要動能包含:厚膜AEC-Q200車規高壓/高功率產品、抗突波與新能源車用貼片電阻;薄膜01005小型化產品供高階穿戴與智慧手機模組化設計、高階惡劣環境用薄膜產品,以及AI伺服器散熱用熱跳線晶片;金屬板MA0508、MR/MU、SRF1216、MU2512與MAH2512等超低阻、高精度、高功率產品,鎖定AI電源模組、AI運算、逆變儲能、EV/BMS及工業自動化。2025年法說會揭露公司透過與麗智南通策略聯盟,整合南通生產基地成本、產能與通用型產品供應彈性,台灣端則聚焦高階、客製化與新技術產品,形成兩岸分工。中長期至2028年的合理展望為:AI伺服器高電流低阻值檢測、電源管理、散熱與高壓供電架構將帶動金屬板與高階薄/厚膜電阻需求;車用電子、新能源、工控、5G、通訊、伺服器與智慧裝置仍是產品開發方向;公司將推動一站式購足策略,提升高附加價值產品比重並降低消費性電子景氣波動。主要風險包含:通用型被動元件價格競爭、原料價格上漲與匯率波動、對單一大客戶仍有約20%營收依賴、國際大廠資源與產能規模優勢、AI與車用客戶認證時程不確定、地緣政治與兩岸供應鏈風險、ESG與環保法規成本。2027至2028屬推估區間,公開資料僅明確揭露115至116年部分AI產品認證/採用預期,未見公司發布2027至2028正式財測。
This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.
This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.