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Help me set up FinLab and analyze 5443 均豪. Please read: https://finlab.finance/en/setup?stock=5443

5443

均豪 Semiconductor As of 2026-06-17 Updated daily after market close

steady quality, fair valuation, no active signal today.

This page refreshes daily after the close. Add 均豪 to your watchlist to track signal changes on your next visit.
Valuation 49Quality 49Growth 4Momentum 54Chips 37

Is 均豪 a buy? Fundamentals and valuation first

  • Above-average profitability.Operating margin is in the 63th market percentile. Latest quarterly ROE ≈ 0.8%.

  • Valuation is neutral.PE is in the 73th market percentile; within its own history, PE is around the 80th percentile.

  • Foreign investors are net selling.Foreign 20-day net flow ≈ -0.4% of volume (net sell).

Chip flow

Bullish +0.59
BearishNeutralBullish

Single-sided accumulation, concentration rising — bullish

  • Single-sided accumulation, concentration rising — bullish
  • 台新 holds 2,162 lots
  • sellers have 5,270 lots left, ~291 sessions to clear

Window from 2026-01-17 · Price +11% · branches to 2026-06-17· TDCC to 2026-06-12

  • Largest holder 台新 has accumulated 2,162 lots since the start (sold 5%), now trimming.
  • Main distributor 美商高盛 peaked at 3,841 lots, has sold 40%, 2,286 left, ~29 sessions to clear at the recent pace.
  • TDCC big holders (absolute) >1000-lot holders +2.88pp, mid holders +11, retail -5.56pp — concentration shifting upward.
  • Foreign hedge-desk net short Net short -1,558 lots (inferred from branch profile, mostly hedging — not necessarily bearish, not case-confirmed).
Branch inventory reconstruction
Accumulating holders Branches that accumulated shares during the window and still hold positive inventory; they are the absorbing side.
Distributing sellers Branches that built inventory earlier and have been selling it down; the remaining number estimates what has not cleared.
Net-short desks Trading-desk branches with negative inventory or net selling, often hedge, offsetting, or short-term flow. It is not automatically a bearish view.
Accumulating
台新群益金鼎-鳳山永豐金-台南元大-府城凱基-桃園華南永昌-竹北
Distributing
美商高盛凱基-台北新加坡商瑞銀摩根大通統一港商野村
Desks
own scale
台灣摩根士丹利元大證券群益金鼎中國信託-文心
Price Accumulating & Distributing share one scale (comparable); Desks is independent. Zero is the baseline
Branch details Unit: lots

Accumulating

  • 台新 +2,162
    sold 5%
  • 群益金鼎-鳳山 +1,252
    sold 0%
  • 永豐金-台南 +1,098
    sold 2%
  • 元大-府城 +787
    sold 0%· still adding
  • 凱基-桃園 +759
    sold 5%
  • 華南永昌-竹北 +714
    sold 10%· still adding

Distributing

  • 美商高盛 2,286 left
    sold 40%· ~29 sessions to clear
  • 凱基-台北 898 left
    sold 67%· ~13 sessions to clear
  • 新加坡商瑞銀 903 left
    sold 66%· paused recently
  • 摩根大通 635 left
    sold 67%· ~132 sessions to clear
  • 統一 258 left
    sold 83%· paused recently
  • 港商野村 670 left
    sold 48%· ~291 sessions to clear

Desks

  • 台灣摩根士丹利 -1,313
    hedge desk · will cover
  • 元大證券 -1,085
    unclassified
  • 群益金鼎 -600
    unclassified
  • 中國信託-文心 -331
    unclassified
Still selling 5,270 lots ~291 sessions to bottom at most
Recent buy/sell force +2,016 absorbed / -2,160 sold sellers slightly ahead
Hedge-desk net short -1,358 lots potential cover-buying, not selling pressure
TDCC big holders · absolute-holding cross-check
>1000-lot holder share Retail (<400 lots) share Price (right axis)

Direction matches: big-holder share rose while retail share fell.

Describes chip flow, not investment advice. Branch data discloses only high-volume branches with ~1-day lag; TDCC is weekly. Inventory is a relative reconstruction from the window start, not absolute holdings.

Historical evidence

Valuation regime and subsequent returns

Each day's PE is converted to its own-history percentile (as of that day), then we look at adjusted-close returns over the next 240 trading days by valuation regime.

PE percentile bandSample days240-day avg returnMedianWin rateAvg excess (vs index)
0-20 248+12.5% -3.6% 42.3% -7.9%
20-40 686+55.8% +45.7% 89.9% +31.2%
40-60 718+28.2% +14.6% 68% +22.4%
60-80 379+71.5% +29.3% 76% +43.2%
80-100 You are here586+33.6% +6.5% 56.1% +18.6%

Percentiles use an expanding own-history window (no look-ahead); forward return is 240 trading days on adjusted close. Sample days overlap; distribution is indicative only.

Current PE ≈ 45.83, at the 80.4th percentile of its own history (80-100 band).

Valuation × momentum historical grid

Every day in its own history is bucketed by valuation tercile (own-history PE) and 60-day momentum sign into six cells; we show adjusted-close returns over the next 120 trading days per cell.

Valuation
Momentum
Cheap (own-history bottom 1/3)
Mid
Expensive (own-history top 1/3)
60-day momentum up
+25.7%
Win rate 79.9% Excess +14%
413d
+9%
Win rate 43.8% Excess +5.3%
562d
Now
+24.8%
Win rate 53.5% Excess +13.4%
579d
60-day momentum down
+20.4%
Win rate 73.1% Excess +7.6%
323d
+11.9%
Win rate 57.4% Excess +9.6%
509d
+25%
Win rate 65.5% Excess +9.9%
351d

Currently in “Expensive (own-history top 1/3) × 60-day momentum up”: across 579 historical days, 120-day forward avg gained 24.8%, win rate 53.5%, beat the market by 13.4%.

Days = trading days in this bucket; returns use adjusted prices, ex-costs. 60-day momentum: direction of this stock's price over the past 60 trading days.

Signals not active (historical stats for reference)

These are not occurring now; historical samples shown for comparison.

252-day price high (breakout)

Pending

Adjusted close makes a new 252-day high; repeats within 20 days counted once.

27 times historically; 60-day forward avg +18.06%, win rate 61.5%, beating the market by +14.42 pts on average.

Monthly revenue YoY ≥ 20% (from filing deadline)

Pending

Monthly revenue YoY ≥ 20%; event date is the first trading day after the filing deadline (no look-ahead).

99 times historically; 60-day forward avg +2.7%, win rate 50%, beating the market by -0.53 pts on average.

Foreign net buying for 5 straight days

Pending

Foreign net flow (ex-dealer) positive for 5 straight days; event on day 5; repeats within 20 days counted once.

60 times historically; 60-day forward avg +10.95%, win rate 61%, beating the market by +6.41 pts on average.

What does 均豪 do? Company profile

半導體業;半導體、顯示器及智慧製造設備 櫃買中心上櫃

Overview

5443 對應證券為均豪,為櫃買中心上櫃普通股,非 ETF、ETN、特別股或權證。公司成立於 1978-12-22,1998-02-09 上櫃,總部位於新竹科學園區新竹縣創新一路 5-1 號,總機 03-5639999。公司英文名 Gallant Precision Machining Co., Ltd.,英文簡稱 GPM。董事長為陳政興,總經理為陳政興與梁又文;梁又文亦為副董事長暨執行長。2026 年公開資料顯示股本約新台幣 16.47 億元,已發行普通股 164,746,644 股。2025 年度合併營收 46.69827 億元,年增 5.30%;均豪個體營收 19.63447 億元,年增 5.90%;均豪個體稅後淨利 4.16948 億元,年增 40.51%,每股純益 2.59 元。員工規模方面,2025 年底合計 787 人,2026-03-31 為 803 人。主要股東資料日期 2026-03-22:志聖工業持有 44,697,827 股、27.13%;均豪庫藏股專戶 3,668,000 股、2.23%;兆銀託管日商麥克尼克司株式會社投資專戶 2,712,000 股、1.65%;元大證券 898,003 股、0.55%;陳政興 786,146 股、0.48%。公司與志聖、均華於 2020 年共同組成 G2C+ 聯盟,整合半導體、面板、PCB 與智慧製造設備技術及供應鏈服務。

Business

均豪為製程與檢測設備廠,從早期面板設備逐步轉型至半導體設備,核心技術包括自動光學檢測、量測、研磨、拋光、智能自動化與 AI 應用。2025 年度營業比重為:半導體製程設備 78.83%、顯示器製程設備 10.20%、智能自動化設備 0.16%、其他 10.81%。主要產品包含半導體封裝製程及檢測設備、覆晶接合設備、晶粒挑撿機、IC 黏晶機、晶圓表面瑕疵檢查機、白光干涉量測系統、載板與 Strip/Panel 研磨機、Batch 式蝕刻/剝膜/顯影/清洗機、失效分析測試設備;顯示器設備包含 Array/Cell 製程設備、TEG Prober、Array Tester、Cleaner、Wet Etching、Edge Grinding、Panel Surface Inspection、Loader/Unloader 與自動化設備;智慧製造包含智慧物流、製程自動化、智慧診斷與預防維護、機器人搬運加工及智慧工廠整合服務。商業模式以客製化設備設計、製造、組裝、測試、裝機驗收與售後服務為主,客戶多屬半導體封裝、晶圓再生、IC 載板、面板與高科技製造業。2025 年內銷 36.32617 億元、占 77.79%;外銷 10.37210 億元、占 22.21%。年報揭露 2025 年銷貨超過或接近 10% 的匿名客戶為 N 客戶 25.09%、S 客戶 15.31%、V 客戶 14.28%、B 客戶 9.56%,未揭露實名。主要原料與零組件包含鋼鐵鋁等金屬材料、功能機構件、培林、伺服馬達、傳動皮帶、彈簧、沖模、工業電腦、人機介面、感知器、電磁閥、伺服控制器、氣缸、風扇、照明、變壓器、電源等,透過協力廠、貿易商或國內市場取得;年報顯示 2024 與 2025 年均無單一進貨供應商超過進貨總額 10%。

Outlook 2025–2028

2025 年均豪已明顯完成產品組合轉型,半導體製程設備占營收 78.83%,營收與獲利均創近年高點;自結資料亦顯示 2025 年歸屬母公司淨利約 4.15 億元、EPS 2.58 元,創 2007 年以來新高。2026 年公司在年報中對半導體設備展望採審慎樂觀,主要動能包括 AI/HPC、先進製程、CoWoS、TSV、RDL、3D/2.5D IC、Fan-out、晶圓再生與先進封裝帶動檢測、量測、研磨、拋光與客製化設備需求。公司 2026 年計畫開發產品包括共同封裝光學測試機台、基板拋光設備、製程設備數位孿生、方板至圓板晶粒外觀檢查挑揀機、矽光子元件挑撿機、Hybrid Die Bonder、高精度六面外觀檢查機、熱壓合黏晶機、CPO Module Sorter、1um 固晶量測應用之 IR 固晶精度量測機等。2026 年預期銷售數量方面,年報列示半導體製程設備 714 套、顯示器製程設備 14 套、智能自動化設備 5 套,依客戶預估與市場情況編列。2027 至 2028 年展望以先進封裝、AI 伺服器、高階載板、玻璃基板、矽光子 CPO、晶圓再生、Micro/Mini LED 與智慧製造為主要延伸方向;年報引用產業資料指出 AI 將帶動前段晶圓製造與後段異質整合設備需求,並預估至 2028 年先進封裝市場仍具成長性。風險與挑戰包括:半導體設備景氣循環、客戶資本支出遞延、匿名主要客戶集中度偏高、台積電等晶圓代工與封測擴產節奏變化、面板設備需求波動、中國設備國產化與低價競爭、匯率與地緣政治風險、客製化設備驗收時程與存貨跌價風險、資安及客戶機密規範要求提高。

Supply Chain

Upstream
  • 志聖工業股份有限公司 2467 最大股東與 G2C+ 聯盟成員;與均豪、均華整合半導體、面板與 PCB 製程設備技術及供應鏈服務,屬策略夥伴與關係企業,不是年報揭露之單一原料供應商。
  • 均華精密工業股份有限公司 6640 均豪關係企業與 G2C+ 聯盟成員,業務涵蓋半導體先進封裝相關設備、精密模具及零組件;與均豪有產能分工、技術整合及設備方案協作。
  • 創峰光電科技股份有限公司 G2C+ 聯盟關係企業,未查得為台股上市櫃公司;主要作為光電、面板及設備相關策略夥伴。
  • 機械結構件與電控零組件協力供應商 年報揭露主要原料包括鋼鐵鋁金屬、機構件、培林、伺服馬達、工業電腦、人機介面、感知器、電磁閥、伺服控制器、氣缸及電源等;2024、2025 年無單一進貨供應商達 10%,公司未揭露供應商實名。
Downstream
  • N 客戶 2025 年度最大銷貨客戶,占銷貨淨額 25.09%;年報以代號揭露,未公開實名,推估屬半導體或高科技製造設備客戶。
  • S 客戶 2025 年度銷貨占比 15.31%;年報以代號揭露,未公開實名,推估屬半導體、封裝、晶圓再生、載板或面板相關設備客戶。
  • V 客戶 2025 年度銷貨占比 14.28%;年報以代號揭露,未公開實名。
  • 台灣積體電路製造股份有限公司 2330 年報與市場資料指出台積電擴廠與先進封裝投資是台灣設備供應鏈重要動能;是否為均豪直接具名客戶未由公司揭露,列為產業下游客戶與可能受益終端。
  • 半導體封測、晶圓再生、IC 載板、面板與智慧製造客戶 公司產品應用於先進封裝、晶圓再生、IC 載板、Micro/Mini LED、FPD 與智慧工廠;多數客戶因商業機密未具名揭露。

Competitors

Sources(14)

This company profile is compiled from public sources (annual reports, filings, news and analyst reports), not finlab backtest data; the 2025–2028 outlook contains forward-looking estimates and is for reference only.

Method and limitations

  • All returns use adjusted close (etl:adj_close), already adjusted for dividends and splits.
  • Excess return is measured against the TAIEX total-return index (dividends included).
  • Valuation regime and percentile stats use an expanding own-history window (no future data).
  • Revenue-signal event dates align to the first trading day after the filing deadline, avoiding look-ahead.
  • Event samples may overlap in time; stats describe historical distribution only and are less reliable when samples are few.

This page is historical statistics for educational purposes and is not investment advice. Investing involves risk; past performance does not indicate future results. Assess and bear the risk yourself before trading.